The candidate says his solution is simple. "I'm going to Washington," he said, "and I say to China, "You want to do business in the United States? You buy something from the United States. I don't care what.
At the Convergence trade show in Detroit, Infineon Technologies AG introduced the first two members of its new family of electronic power modules designed for hybrid electric vehicle motor drive systems. Based on Infineon's proven power semiconductors and a system-level design approach, the new HybridPACK1 and HybridPACK2 power modules reduce the cost and complexity of HEV inverter system design
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California's sp3 Diamond Technologies Inc. has formed a partnership with Chartley-based Ceramics Process Systems Corp., producer of aluminum silicon carbide (AlSiC) thermal management and packaging software.
SANTA CLARA, Calif.----sp3 Diamond Technologies, Inc. , a supplier of DiaTherm diamond heat spreaders and diamond products for solving thermal management challenges in high-performance applications, announces a strategic partnership with Ceramics Process Systems , a developer and manufacturer of Aluminum Silicon Carbide thermal management and packaging solutions.
Cree, Inc. , a leader in LED solid-state lighting components, today announced new benchmarks for power LED brightness and efficacy with the release of the newest white Cree XLamp(R) 7090 power LED. This new XLamp LED, available in volume quantities, produces luminous flux of up to 95 lumens or 85 lumens per watt at 350 mA, and up to 160 lumens at 700 mA.
CHARTLEY, Mass.----Ceramics Process Systems Corporation , a developer and manufacturer of Aluminum Silicon Carbide thermal management and packaging solutions announced today a strategic partnership with sp Diamond Technologies, Inc. (sp), a supplier of DiaTherm diamond heat spreaders and diamond products for solving thermal management challenges in high-performance applications.
Microsemi Corporation , a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, has announced that Congress has appropriated $1.8 million to allow Microsemi's Power Products Group to develop technology related to the use of silicon carbide semiconductor components in military avionics applications.